Brand Name : Found
Model Number : FD-051
Certification : UL E361831
Place of Origin : China
MOQ : 1 PC
Price : negotiable
Payment Terms : T/T
Supply Ability : 10 000
Delivery Time : 5-8 work days
Packaging Details : Vacuum Packing
Material : Blank or Printed
Base Material : FR-4 High TG
Copper Thickness : 1 oz
Board Thickness : 1.6 mm
Base Materia | FR-4 |
Board Thickness | 1.2+/-0.12mm |
size | 190mm*90mm |
Min. Hole Size | 0.25mm |
Min. Line Width | 0.12mm |
Min. Line Spacing | 0.134mm |
Min. Hole Copper | 22um |
Copper Thickness | 1OZ |
Properties | Technical possibilities |
Circuit board types | one- and double-sided boards, multilayer, Flex, Teflon, high-frequency, metal core, ... |
Number of layers | up to 24 layers |
Base materials | - FR4, FR4 halogenfree, CEM1, CEM3 - HF-boards - High-Tg Epoxy - Alu - PTFE, Rogers, Arlon, Nelco, Polyimide |
Max. board size | 610 mm x 535 mm ( 535mm x 810mm ) |
Board thickness | 0,20 mm – 4,0 mm |
Inner layer thickness | 0,10 mm – 1,6 mm |
Min. conductive track width and min. track distance | 50 μm |
Copper coating thickness of the outer layers | 12 μm – 105 μm, 210 μm, 400 μm |
Copper coating thickness of the inner layers | 12 μm – 105 μm |
Drill diameter | 0,15 mm – 6,40 mm |
Drill diameter (plated) | 0,10 mm – 6,35 mm |
Metallization Aspect Ratio | 12 : 1 |
Blind VIAS Aspect Ratio | 1 : 1 |
Solder stop mask | green - mat and glossy, black - mat and glossy, white, blue, red, yellow (min. distance 50 µm ) |
Legend printing | white, green, yellow, black, red, blue |
Removable solder stop mask | Peters blue |
Vias / filler | with Solder stop or filler lacquer |
Carbon Print | 40 Ohm ± 5% |
End coating | HAL lead-free HAL PbSn chemical NiAu ( ENIG) chemical Ag chemical Sn OSP Hard gold |
Tolerance | milling ± 0,05 mm scoring ± 0,10 mm etching ± 10% Hole tolerance (press-fit) ± 0,05 mm |
Quality management | UL certified Cross-section imaging Measuring machine for size precision automatised optical inspection (AOI) X-ray E-Test ISIR |
Specials | blind vias buried vias press-fit press-fit - with back drilling controlled impedance side plating (metal plating edges, half-holes) deep routing jump scoring countersink BGA Raster 0,5mm |
Surface
HAL - Pb free |
HAL leaded |
Immersion tin |
Immersion silver |
Electroless nickel / immersion gold (ENIG) |
Galvanic nickel gold |
Over 10 years' manufacturing experience
Assembly provided
100% quality tested before shipment
Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
Our Products meet the RoHS & WEEE lead-free requirement.
Small Order accepted
3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
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